TE Connectivity (TE) and Credo had teamed up to demonstrate the future of networking technologies at DesignCon 2018. The companies held demonstrations of 112Gbps over an IO channel and over a backplane channel. Unlike many other attendees of the convention, who focused on discussion and theory, TE and Credo demonstrated performance on actual hardware.
The IO channel demonstration used TE’s OSFP (octal small form factor pluggable) IO connector with Credo’s 16nm, lower power, high performance 112G PAM4 SerDes technology to exhibit operation over a 10-inch printed circuit board (PCB) channel.
The backplane demonstration uses TE’s latest STRADA Whisper orthogonal backplane connector operating with a total channel loss of 20 dB at 28 GHz in a PCB-based direct plug orthogonal (DPO) architecture. Driven by Credo’s 112G PAM4 SerDes, the demo shows BER performance levels that fully enable the adoption of STRADA Whisper solutions for the next wave of networking equipment. The technology is possible through Credo’s innovative outlook on low power silicon being advanced to 112G SerDes.
DesignCon is an engineering-focused conference that brings together 5,000 professionals from high-speed communication and semiconductor communities for three days in Santa Clara, showcasing new technologies for advanced packaging, printed circuit board fabrication, connectors, cables, and related analysis equipment. This January, DesignCon celebrated its 23rd anniversary.
Subscribe to our Newsletter and stay tuned.